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> lk-F6 hot air & ir heating bga rework station
lk-F6 hot air & ir heating bga rework station
Hot air & IR Heating BGA Rework Station
This station can repair the large circuit board such as mainboards of computer, game machine and communications equipment.
The machine can dry the circuit board.
The infrared and hot air dual heating is used for this machine
The lower part of this machine is the preheating station which is used for the preheating of the PCB boards to ensure that the PCB board is not deformed.
Dimensions: length 410mm width 400mm high 380mm
The area of preheating: 360mm*300mm.
Power supply: 220-230V 50/60HZ.
Upper heating temperature is related to nozzle
nozzle 43 mm *43 mm , Upper heating temperature is 240
nozzle 37 mm *37 mm , Upper heating temperature is 230
nozzle 23 mm *23 mm , Upper heating temperature is 210
nozzle 28 mm *28 mm , Upper heating temperature is 220
nozzle 43 mm *43 mm , Upper heating temperature is 270
nozzle 37 mm *37 mm , Upper heating temperature is 260
nozzle 28 mm *28 mm , Upper heating temperature is 250
nozzle 23 mm *23 mm , Upper heating temperature is 240
Upper heating temperature: 280
1. There are two commonly used solder ball, one is solder with lead, the other is lead-free solder. The melting point of the majority of lead solder is 183 degrees, while that of lead-free solder is 217 degrees.
2. PCB boards not having done drying should not be rapidly heated, otherwise, PCB board or BGA chip may be damaged. Damage is mainly presented in bubble, burst, and sometimes a little sound may be heard.
3. The temperature sensor of LK-F6 has not directly contact with circuit board and it is designed to detect the air temperature around the circuit board, and the value that thermometer shows is not the actual temperature of the circuit board.
4. Some electrolytic capacitors, plastic socket, plastic socket can not bear high temperature. In order to prevent its being baked in high-temperature, please paste the insulation film on the surface.
5. The residual solder on the pad should be erased with good performance iron, and it should be finished carefully to avoid knock_off the PCB board pad.
6. PCB board after removed solder should be cleaned, and the pad should be bright on its surface, otherwise, they might not stick the solder.
7. Circuit board after soldering should be cooled to room temperature before testing.
8. Too long time heating may cause discoloration of circuit board.
9. After the surrounding area of BGA chips is pasted with heat-proof tape, the heat transfer may be affected; resulting in un-melted solder after the process. By extending the heating time, this problem can be solved.
10. Solder melting around 20 seconds before the end of the work process is appropriate. If the solder melting time is too long in advance, it is suggested to reduce the temperature appropriately to prevent heat damage or even chip welding. If the time of molten solder in advance is too short, it is suggested to increase the temperature appropriately to prevent non-welding.
