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> Smt to dip adaptors, 0.05", 8-24 pin converter smd #21
Smt to dip adaptors, 0.05", 8-24 pin converter smd #21
Row spacing: 0.600", ready for socket insertion
This listing is for style #21, shown below
For case: SOIC, narrow, wide, 8 through 24 pin
Row spacing: 0.600", or 0.700" selectable
This is a TOP or BOTTOM soldered carrier.
For solderless breadboards, custom PCB or applications not requiring insertion in a socket: Pins thru-hole soldered on the OUTER (0.700" accross) rows of pads. Use a solderless breadboard to hold headers in place while soldering. Avoid overheating, or header frame melts.
For direct socketing to 0.600" DIP sockets: Pins can be surface-soldered on the bottom of the PCB, using the INNER (0.600" accross) rows of pads. Pins do not emerge to the top side (except for the corner pins).
