Environmentally Conscious and Economically Sound Machine Dismantling Forum > Madison, WI
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> Ir-heating bga rework station lk-F3
Ir-heating bga rework station lk-F3
IR-Heating BGA Rework Station LK-F3
Dimensions: length 410mm width 400mm high 320mm
Power supply: 220-230V 50/60HZ.
Bottom heating size: 360*320mm
This station can be used for the repairing of the large circuit board such as mainboards of computer, game machine and communications equipment.
The machine can be used to do the drying of the circuit board.
The lower part of this machine is the preheating station which is used for preheating the PCB boards to ensure that the PCB board is not deformed.
Upper heating temperature: 260
1. Since the date of purchase, we are responsible to replace this product in one year, after one year, the repair parts and materials will be charged.
2. The modifications on the product structure, circuit by users are not include in the scope of the warranty.
3. In the warranty period, if there is the problem in the quality of the product itself, we will replace the parts or repair free of charge, but the transportation fee will be charged.
4. For the circumstances cause by the fault of users, such as operation error, self-changing the internal structure, the product will not be exchanged.
5. The device is not waterproof, it is strictly prohibited to be watered.
6. The normal operating voltage of the machine is 220-230V; please do not use incorret power supply.
7. In using this equipment, please first ensure the effective grounding to prevent power leakage.
8. In the operation of this equipment, the pre-heating station and heating head are at a high temperature, do not contact these sites with the skin to prevent scalding.
PS : the welding common knowledge
1. There are two commonly used solder ball, one is solder with lead, the other is lead-free solder. The melting point of the majority of lead solder is 183 degrees, while that of lead-free solder is 217 degrees.
2. PCB boards not having done drying should not be rapidly heated, otherwise, PCB board or BGA chip may be damaged. Damage is mainly presented in bubble, burst, and sometimes a little sound may be heard.
3. The temperature sensor of LK-F3 has not directly contact with circuit board and it is designed to detect the air temperature around the circuit board, and the value that thermometer shows is not the actual temperature of the circuit board.
4. Some electrolytic capacitors, plastic socket, plastic socket can not bear high temperature. In order to prevent its being baked in high-temperature, please paste the insulation film on the surface.
5. The residual solder on the pad should be erased with good performance iron, and it should be finished carefully to avoid knock_off the PCB board pad.
6. PCB board after removed solder should be cleaned, and the pad should be bright on its surface, otherwise, they might not stick the solder.
7. Circuit board after soldering should be cooled to room temperature before testing.
8. Too long time heating may cause discoloration of circuit board.
9. After the surrounding area of BGA chips is pasted with heat-proof tape, the heat transfer may be affected; resulting in un-melted solder after the process. By extending the heating time, this problem can be solved.
10. Solder melting around 20 seconds before the end of the work process is appropriate. If the solder melting time is too long in advance, it is suggested to reduce the temperature appropriately to prevent heat damage or even chip welding. If the time of molten solder in advance is too short, it is suggested to increase the temperature appropriately to prevent non-welding.
