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New coorstek 236MM sc-ds silicon carbide wafer chuck


* Nominal Flatness-Top-A: .005mm
* Nominal Parallelity-Bottom: .005mm
* Nominal Insert Recess: .5 +/- .15
Flexural Strength (MOR), 20 degrees C
Tensile Strength, 25 degrees C
Thermal Conductivity, 20 degrees C
Coefficient of Thermal Expansion, 25-1000 degrees C
Thermal Shock Resistance, (delta)Tc
Dielectric Loss (tan delta) 1MHz
Volume Resistivity, 25 degrees C
Volume Resistivity, 500 degrees C
Volume Resistivity, 1000 degrees C
Please Note: This Chart is of nominal values and may not be exact on the item received.



New coorstek 236MM sc-ds silicon carbide wafer chuck