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New duplex ir heating bga rework station
NEW duplex IR heating BGA rework station HR-pro
The ACHI HR-PROis a duplex IR heating BGA rework station. It can be afforded to weld, remove and rework the applications with different packages and mutil-level base board such as BGA,PBGA,CSP and make lead-free welding. The target of this product is BGA packages (including north and south bridges Chipsets) of the main boards and video cards of notebooks, desktops, XBOX, switches and so on.
Its features contains as follow:
1. Duplex IR heating system. Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep solder effect, heating board is independent controlled , in contrast with Hot Air Heating, the process of heating is more stable. More, there is no nozzles required and can help you save the costs.
2. Independent heating for the top and bottom sides, also Independent heating up for the both sides. In this way, it is easier to control. Also, Over and Under Heat Alarm.
3. We have taken full consideration to the situation of small workshops and cut down the costs as possible while this product can realize the main functionalities (BGA manual welding, lead-free soldering) of the advanced rework system.
4. The station is parted designed, with high quality, and can be handled conveniently. Use of innovative design, do not need to connect your computer can easily operate
5. No hot air flow in process of rework, does not affect the surrounding micro-components
6. The upper part of heating a large area can easily rework the various CPU block, all kinds of shielding enclosures, replacement of various components slot
7. The machine can be very reliably to replace the double-layer BGA chips.there won t solder paste betweem Double-layer BGA chip .
8. The machine can heat chip BGA solder ball directly, steel mesh is not deformed in the heating process
9. The machine can do the circuit board drying and shaping circuit board.
Area of prehe at the bottom is 260X245 (can rework 400x305 circuit board) act in concert with the slide bracket and the cross-flow cooling fan to ensure the PCB board rework is not deformed during
The heating elements: Sirocco 800w
Applicable BGA size: 40mm 40mm
Bottom preheating components: Infrared 2000W
Bottom preheating components size: 260 mm 245 mm
The heating regulation: Up and down Left and right
Fixed mode: Alien stents ,stents
