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Besttech T870 infrared bga rework station xbox repair
BestTech T870 Infrared BGA Rework Station Xbox Repair
BestTech T870/870A Infrared BGA Rework Station, best for Xbox 360, PS3, Wii Repair
T870/870A outputs a wide range of heat, enable you to remove a 50mm thick of component in serveral minutes. Its temperature is adjustable. Its ability is far beyond other similiar equipment. It is ideal for resoldering or removing of ICs like CPUs, GPUs, South-Bridges, North-Brideges Scalers, etc..
Heat evenly and energy seeps through IC evenly to enable the IC's top and bottom surfaces receive heat in the same feature, so that ensuring the compponents and circuit boards expand with heat and contract with cold evenly, avoiding the component blowout, circuit break, or the PCB deformation.
Infrared heating does not blow sirocco flow, so it does not need the thermonuclear conduction medium like air to act on ICs directly, it will not dislocate the surrounding parts, and the operator will not have a hot feel.
It can use for removing or repairing PCB with component of BGA, QFP, SOP, PLCC, DIP, it's best for BGA reworking, reballing or removing.
The station's mechanical arm can turn around or move up and down, its thermal radiation window is adjustable to fit the size of component, which will protect small component from dislocation or fall away.
It is suitable for reworking, reballing or removing chips size up to 50mm x 50mm
It has controllable preheating devices. preheat PCB first to aviod its deformation.
* Preheating device power: 800W
* Infrared Temp. Range: 200 oC ~450 oC
* Preheating Temp. Range: 60oC ~200 oC
* Suitable for IC size: 35 x 35 ~ 50 x 50 mm
* Preheating size: 240 x 180 mm
* Dimensions: 36 x 34 x 33 cm
