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Temptronic TP03010B thermochuck thermal vacuum platform
Temptronic TP03010B-2100-1 ThermoChuck Thermal Inducing Vacuum Platform
Specifications are from Temptronic and may vary slightly due to upgrades, options, or revisions this unit may or may not have.
The unit is guaranteed to work for 90-days, excluding freight.
THEMAL CHUCK IS NOT INCLUDED!!
Power Requirements: 115 V, 50/60 Hz, Single Phase, 10 Amps
Configuration by Model Number:
* System Configuration: Pump & Reservoir, Closed Loop Cooling
* System originally supplied with 200 C ThermoChuck (Chuck not included)
* Remote Communications Interface configured for GPIB (IEEE-488)
* 115 VAC System Configuration
Chuck Diameters: Available from the factory in 5 inch (129 mm), 6 inch (154 mm) and 8 inch (203 mm) diameters to accommodate wafers up to 200mm in diameter.
Chuck Surfaces: Choice from the factory of gold-plated or nickel-plated surface is standard. Other optional surfaces available.
* Wide Temperature range: 0 to +200 C
* DC Control System minimizes electrical noise
* Temperature Accuracy: 0.5 C (calibrated against transfer standard)
* Temperature Stability: 0.1 C
* Advanced ThermoChuck Design:
* Low stray capacitance and high electrical resistance to ground: Surface Electrical Isolation: >109 ohms at 500 VDC between surface and ground at +25 C ; higher isolation configurations are available
* Superior chuck temperature uniformity: 0.5 C or 0.5% of set temperature
* Guarded (low leakage) chuck configurations are optional from factory
* IEEE-488 GPIB remote interfaces
* ThermoChuck interfaces to most major standard and automatic wafer probing stations, laser trimmers and inspection stations
* No Liquid Nitrogen or CO2 is required for cooling.
* Thermal cycling and steady- state thermal testing of wafers, hybrids and other flat devices from 0 C to 200 C
* Moisture-free cold testing of wafers to 0 C with Controlled Environment Enclosure
* Low noise test applications
* High isolation and guarded (low leakage) applications
* Thermal characterization of standard and high power devices at high and low temperatures.
* Moisture-free cold testing of wafers with Controlled Environment Enclosure
Control Method: Bi-Polar DC proportional, Integral Derivative (PID)
Temperature Range: 0 C to +200 C (Chuck Specific)
Temperature Accuracy: 0.5 C (when calibrated against primary or transfer standard)
Temperature Stability: 0.1 C
Ambient Operating Temperature: +10 C to +30 C
Humidity Operating Range: 0 to 90% non-condensing
Overheat Protect Temperature: For all systems, high temperature in system temperature range +5 C +135 C (high temperature range: +130 C) +205 C (high temperature in range: +200 C)
Temperature Display: Four digits, LED readout, 0.1 C resolution
Local Control: 3 pushbuttons for the selection of two operating temperatures and one "ambient" preset temperature. 4 x 4 keypad for the setting of temperatures and all other system control parameters.
Status Indicators: Seventeen LED lamps to indicate operating mode, selected setpoint and operating state of IEEE-488 interface
Non-Volatile Memory: Battery back-up retention of temperature setpoint ad "at temperature" window values, ramp times, soak times and number of cycles and communication parameters for IEEE-488
Power Requirements: 115 VAC, 50/60 Hz, (100 to 130 V Range), 10 Amps
Dimensions: 15.24 cm H x 48.9 cm W x 72.4 cm D (6" x 19.25" x 28.5" D)
* Picture 4 - Thermal Devices Cable
